| |
Activation
|
|
Energizing the surface to
encourage deposition of the surface. |
|
| |
Adhesion |
|
The attractive force that
exists between the electro-deposit and its substrate. |
|
| |
Alodine |
|
Protective coating chemical for
aluminum. |
|
| |
Barrel Plating |
|
Plating or cleaning in which
the work is processed in bulk in a rotating container. |
|
| |
Basis Metal |
|
A metal that readily oxidizes
or disolves to form ions. |
|
| |
Blister |
|
A dome shaped imperfection or
defect, resulting from the loss of adhesion between a metallic deposit
and the substrate. |
|
| |
Brightener |
|
An addition agent that leads to
the formation of a bright plate or that improves the brightness of the
deposit. |
|
| |
Buffing |
|
The smoothing of a surface by
means of a rotating wheel. |
|
| |
Burnt Deposit |
|
A rough, nonadherent or
otherwise unsatisfactory deposit produced by the application of an
excessive current density and usually to the anode and cathode bars. |
|
| |
Bus Bar |
|
A rigid conducting section, for
carrying current to the anode and cathode bar. |
|
| |
Contamination |
|
An inclusion of foreign
material detectable on the surface of a part. |
|
| |
Cross-section |
|
A destructive test whereby an
item is mounted in a plastic resin, then cut to expose a cross section
of the plate. The thickness of the plated layers are then measured
under a microscope. |
|
| |
Dummy Plate |
|
A cathode in a plating solution
that is not used after plating. Often used for removal or
decomposition of impurities. |
|
| |
Electrode |
|
A conductor through which
current enters or leaves an electrolytic cell, at which there is a
charge from conduction by electrons to conduction by charged particles,
or vice versa. |
|
| |
Flash Plate |
|
A thin electrodeposit less than
2.5 mm. |
|
| |
Humidity Testing |
|
A test to evaluate the
performance and adhesion of the coating. The test takes place in a
100% humid chamber. |
|
| |
Hydrogen Embrittlement |
|
Emprittlement of a metal or
alloy caused by absorption of hydrogen during a pickling, cleaning or
plating process. |
|
| |
Limiting Current Density |
|
The Maximum current density at
which satisfactor deposits can be obtained. |
|
| |
Masking |
|
Materials applied to specific
areas of parts to prevent coatings from being deposited. |
|
| |
Micron |
|
40 mils or 40 millionths of an
inch |
|
| |
Mil |
|
A millionth of an inch. |
|
| |
Mil Spec |
|
The standard military spec for
plating is 60 millionths of an inch. |
|
| |
Nodule |
|
A rounded projection formed on
a cathode during electroplating. |
|
| |
Passivity |
|
The inertness of certain
substances under conditions in which chemical activity is expected. |
|
| |
Pickling |
|
The removal of oxides or other
compounds from the surface of a pickle. |
|
| |
Pit |
|
A small depression or cavity
produced in a metal surface during electro deposition or by corrosion. |
|
| |
Plating |
|
Forming a layer of metal on an
object from a plating solution. |
|
| |
Post-finishing |
|
A procedure which is applied to
an item after it is plated, such as painting or chromating. |
|
| |
Pre-finishing |
|
A procedure that is performed
prior to plating to make the product suitable to receive the plate, for
example, vibratory cleaning. |
|
| |
Quality Control |
|
Processing parts exactly to
customers specifications in a timely manner and for a competitive price. |
|
| |
Rack Plate |
|
A frame for suspending and
carrying current to articles during plating and related operations. |
|
| |
Robber |
|
An auxiliary cathode so placed
as to divert to itself some current from protions of the work which
would otherwise receive too high a current density. |
|
| |
Scale |
|
An adherent oxide coating that
is thicker than the superficial film referred to as tarnish. |
|
| |
Shield |
|
A non-conducting medium for
altering current distribution on an anode or cathode. To alter the
normal current distribution on an anode or cathode by the interpostion
of a nonconductor. |
|
| |
Smut |
|
A black powdery finish that is
easily removed with a mild abrasive. |
|
| |
Strike |
|
A thin film of metal to be
followed by other coatings. |
|
| |
Substrate |
|
The material upon which
deposits are applied; basis metal or material. |
|
| |
Tarnish |
|
The dulling, staining on
discoloration of metals due to superficial corrosion. |
|
| |
Tumbling |
|
A pre-finish that takes place
in a rotating barrel with abrasive medium. |
|
| |
Void |
|
A defective area in which a
part of the basis material or underlayer is visible after the final
coating. |
|
| |
Wetting Agent |
|
A substance that reduces the
surface tension of a liquid, thereby causing it to spread more rapidly
on a solid surface. |
|
| |
Whiskers |
|
Metallic filamentary growths, often
microscopic, sometimes formed during electrodeposition and sometimes
forming spontaneously during storage or service, after finishing. |
|
| |
X-ray Fluorescence |
|
A non-destructive test to determine the
thickness of various layers of metal on a part. Common elements
measured on a part; silver, gold, zinc, nickel and cadmium. |
|
